Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10779405 | Landless multilayer circuit board and manufacturing method thereof | Ting-Hao Lin, Yi-Nong Lin | 2020-09-15 |
| 10779418 | Manufacturing method of double layer circuit board | Ting-Hao Lin, Yi-Nong Lin | 2020-09-15 |
| 10720694 | Antenna carrier plate structure | Ting-Hao Lin, Yung-Lin Chia | 2020-07-21 |