Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10868062 | Sensor package structure | CHIEN-CHEN LEE, Chien LIN, Jian-Ru Chen | 2020-12-15 |
| 10600829 | Package base core and sensor package structure | Chung-Hsin Hsin, Chien LIN, KUN-CHIH HSIEH | 2020-03-24 |