Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840619 | Assembling structure for expansion card | Jun Wang, Tai-Hsun Wu | 2020-11-17 |
| 10821634 | Method for compression-molding foamed polymer article | — | 2020-11-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840619 | Assembling structure for expansion card | Jun Wang, Tai-Hsun Wu | 2020-11-17 |
| 10821634 | Method for compression-molding foamed polymer article | — | 2020-11-03 |