Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10731925 | Micropillar-enabled thermal ground plane | Ryan John Lewis, Li-Anne Liew, Ching-Yi Lin, Collin Jennings Coolidge, Shanshan Xu +1 more | 2020-08-04 |
| 10724804 | Method and device for spreading high heat fluxes in thermal ground planes | Ryan John Lewis, Ronggui Yang | 2020-07-28 |
| 10571200 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2020-02-25 |
| 10527358 | Thermal ground plane | Ronggui Yang, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi +2 more | 2020-01-07 |