Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10820414 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Hideta Arai, Atsushi Miki | 2020-10-27 |
| 10791631 | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | Yuki Ori, Hideta Arai, Atsushi Miki | 2020-09-29 |