Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10855009 | Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pin | Soon Seong Choi, Jeong Hun Cho | 2020-12-01 |
| 10714450 | Method of bonding terminal of semiconductor chip using solder bump and semiconductor package using the same | SoonSeong Choi | 2020-07-14 |
| 10541197 | Press-fit pin and semiconductor package including the same | Soon Seong Choi, Jeong Hun Cho | 2020-01-21 |
| 10535589 | Clip structure and semiconductor package using the same | Armand Vincent C. Jereza | 2020-01-14 |