Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763128 | Process of surface-mounting three-dimensional package structure electrically connected by prepackaged metal | Haishen Kong, Yubin Lin, Xinfu Liang, Qingyun Zhou | 2020-09-01 |