Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861868 | Methods for forming structurally-reinforced semiconductor plug in three-dimensional memory device | Yangbo Jiang, Liang Wu, Ya Wang | 2020-12-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10861868 | Methods for forming structurally-reinforced semiconductor plug in three-dimensional memory device | Yangbo Jiang, Liang Wu, Ya Wang | 2020-12-08 |