Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763201 | Lead and lead frame for power package | Kang Rim Choi | 2020-09-01 |
| 10672691 | Thin profile power semiconductor device package having face-to-face mounted dice and no internal bondwires | — | 2020-06-02 |