Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679965 | Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit | Chia-Wei Li | 2020-06-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679965 | Semiconductor package structure with preferred heat dissipating efficacy without formation of short circuit | Chia-Wei Li | 2020-06-09 |