Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879211 | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured | Dennis Zegzula, Ching Au | 2020-12-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10879211 | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured | Dennis Zegzula, Ching Au | 2020-12-29 |