Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553475 | Single layer integrated circuit package | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Hai San Tew, Shin Hung Hwang +2 more | 2020-02-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10553475 | Single layer integrated circuit package | Zalina Binti Abdullah, Roslan Bin Ahmad, Poh Cheng Ang, Hai San Tew, Shin Hung Hwang +2 more | 2020-02-04 |