Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Seungwon IM, Oseob Jeon, Byoungok LEE, Joonseo SON, Dukyong LEE +1 more | 2020-03-31 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607919 | Semiconductor package having junction cooling pipes embedded in substrates | Seungwon IM, Oseob Jeon, Byoungok LEE, Joonseo SON, Dukyong LEE +1 more | 2020-03-31 |