Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10804217 | EMI shielding for flip chip package with exposed die backside | ChangOh Kim, Il Kwon Shim, InSang Yoon, KyoungHee Park | 2020-10-13 |
| 10784210 | Semiconductor device with partial EMI shielding removal using laser ablation | ChangOh Kim, KyoWang Koo, BongWoo Choi, Jiwon Lee | 2020-09-22 |