Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605850 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Michael Russell Uy Gonzales, Mark Tiam Weng Lam | 2020-03-31 |
| 10601404 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2020-03-24 |