Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10605850 | Screening methodology to eliminate wire sweep in bond and assembly module packaging | Stephen P. Ayotte, Michael Russell Uy Gonzales | 2020-03-31 |
ML
Mark Tiam Weng Lam
Overall (2020): #361,463 of 565,922Top 65%
1
Patents 2020