Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833243 | System and method for providing multi-conductive layer metallic interconnects for superconducting integrated circuits | Denis Amparo, Richard Hunt, John Vivalda, Daniel Yohannes | 2020-11-10 |