Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727162 | Integrated circuit having a heat sink coupled to separate ground planes through vias with different thermal characteristics | Robert M. Young, Daniel R. Queen, Aaron Ashley Hathaway, John X. Przybysz | 2020-07-28 |
| 10644218 | Multichip device with temperature isolating bump bonds | Aaron Ashley Hathaway, Robert M. Young, JUSTIN C. HACKLEY | 2020-05-05 |
| 10629535 | Thermally isolated ground planes with a superconducting electrical coupler | Aaron Ashley Hathaway, Daniel R. Queen, John X. Przybysz, Robert M. Young | 2020-04-21 |