Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600759 | Power and ground design for through-silicon via structure | Chih-Pin Hung, Ying-Te Ou | 2020-03-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10600759 | Power and ground design for through-silicon via structure | Chih-Pin Hung, Ying-Te Ou | 2020-03-24 |