Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607963 | Chip package for two-phase cooling and assembly process thereof | Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Jeffrey D. Gelorme, Gerard McVicker +4 more | 2020-03-31 |
| 10548228 | Thermal interface adhesion for transfer molded electronic components | Timothy J. Chainer | 2020-01-28 |