Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763234 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2020-09-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763234 | Semiconductor device structure having semiconductor die bonded to redistribution layer via electrical pad with barrier layer | Chi-Yu Wang | 2020-09-01 |