Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10790158 | Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern | Yaojian Lin, Hin Hwa Goh, Il Kwon Shim | 2020-09-29 |
| 10741416 | Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Xu Sheng Bao | 2020-08-11 |
| 10707150 | Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu, Yu Gu | 2020-07-07 |
| 10662056 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2020-05-26 |
| 10622293 | Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) | Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin, Pandi C. Marimuthu, Xusheng Bao +1 more | 2020-04-14 |
| 10607946 | Semiconductor device and method of forming interconnect substrate for FO-WLCSP | Yaojian Lin, Jianmin Fang, Xia Feng | 2020-03-31 |