Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10651233 | Method for forming superconducting structures | Jeffrey David Hartman | 2020-05-12 |
| 10644218 | Multichip device with temperature isolating bump bonds | Aaron Ashley Hathaway, Robert M. Young, Patrick Alan Loney | 2020-05-05 |