Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10784234 | Die encapsulation in oxide bonded wafer stack | Jason G. Milne | 2020-09-22 |
| 10679888 | Foundry-agnostic post-processing method for a wafer | Mary A. Teshiba | 2020-06-09 |
| 10541461 | Tile for an active electronically scanned array (AESA) | Mary A. Teshiba, Jason G. Milne, Kevin C. Rolston | 2020-01-21 |