Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763129 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Choong Hoe Kim | 2020-09-01 |
| 10586761 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dae Byoung Kang, Chel Woo Park | 2020-03-10 |