Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10665534 | Semiconductor device and method of using partial wafer singulation for improved wafer level embedded system in package | KyungHoon Lee, SangMi Park, KyoungIl Huh | 2020-05-26 |