Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10625257 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2020-04-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10625257 | Direct bond transfer layers for manufacturable sealing of microfluidic chips | Joshua T. Smith, Chao Wang, Benjamin H. Wunsch | 2020-04-21 |