Issued Patents 2020
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854731 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2020-12-01 |
| 10818774 | Plugs for interconnect lines for advanced integrated circuit structure fabrication | Ilsup JIN, Angelo Kandas, Michael L. Hattendorf, Christopher P. Auth | 2020-10-27 |
| 10796951 | Etch-stop layer topography for advanced integrated circuit structure fabrication | Ruth A. Brain, Michael L. Hattendorf, Christopher P. Auth | 2020-10-06 |
| 10777655 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Joseph M. Steigerwald, Jinhong SHIN, Vinay Chikarmane, Christopher P. Auth | 2020-09-15 |
| 10541316 | Contact over active gate structures for advanced integrated circuit structure fabrication | Tahir Ghani, Atul MADHAVAN, Michael L. Hattendorf, Christopher P. Auth | 2020-01-21 |