Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10653010 | Connection of multilayer printed conductive ink through filled microvias | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2020-05-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10653010 | Connection of multilayer printed conductive ink through filled microvias | Weifeng Liu, William L. Uy, Dongkai Shangguan | 2020-05-12 |