Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10546750 | System and method for substrate wafer back side and edge cross section seals | The-Tu Chau, Kyle Terrill, Deva Pattanayak, Sharon Shi, Kuo-In Chen +1 more | 2020-01-28 |