Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10877530 | Apparatus and method to provide a thermal parameter report for a multi-chip package | Tessil Thomas, Robin A. Steinbrecher, Sandeep Ahuja, Timothy Y. Kam, Howard Chin +2 more | 2020-12-29 |