Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10794840 | Apparatus for semiconductor package inspection | Jianyong Mo, Darren Vance, Di Xu, Gregory S. Clemons, Robert F. Wiedmaier | 2020-10-06 |
| 10572992 | 2D metrology technique for solder paste inspection | Alireza Ashari, Curt Carboni, Jason Jones, Robert F. Wiedmaier, Di Xu +1 more | 2020-02-25 |