Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727044 | Fill material to mitigate pattern collapse | Desaraju V. Varaprasad, Songyuan Xie | 2020-07-28 |
| 10544330 | Gap filling dielectric materials | Yamini Pandey, Helen Xu | 2020-01-28 |