Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643862 | System-level packaging method and packaging system based on 3D printing | Xingyin Xiong, Kedu Han, Changchun Yang | 2020-05-05 |
| 10557176 | Method for detecting trace fungi using single-cell sequencing and kit thereof | Ying Yang, Shengqi WANG, Zhe Zhou, Min Hao Chen, Peng Wang +1 more | 2020-02-11 |