SY

Swain Hong Yeo

Infineon Technologies Ag: 1 patents #355 of 900Top 40%
📍 Singapore, SG: #444 of 1,778 inventorsTop 25%
Overall (2020): #257,749 of 565,922Top 50%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10861828 Molded semiconductor package having a package-in-package structure and methods of manufacturing thereof Hui Teng Wang 2020-12-08