Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777506 | Silicon carbide semiconductor device having a metal adhesion and barrier structure and a method of forming such a semiconductor device | Ravi Keshav Joshi, Michael Fugger, Oliver Humbel, Thomas Laska, Matthias Müller +6 more | 2020-09-15 |
| 10636900 | High voltage termination structure of a power semiconductor device | Viktoryia Uhnevionak, Philip Christoph Brandt, Alexandra Ludsteck-Pechloff, Frank Pfirsch | 2020-04-28 |
| 10535743 | Metallization and its use in, in particular, an IGBT or a diode | Hans-Joachim Schulze | 2020-01-14 |