Issued Patents 2020
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854739 | Method for producing IGBT with dV/dt controllability | Antonio Vellei, Markus Beninger-Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +1 more | 2020-12-01 |
| 10840362 | IGBT with dV/dt controllability | Alexander Philippou, Markus Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +3 more | 2020-11-17 |
| 10833218 | Semiconductor wafers and semiconductor devices with barrier layer and methods of manufacturing | Roland Rupp, Hans-Joachim Schulze | 2020-11-10 |
| 10796914 | Method for processing a wafer, and layer stack | — | 2020-10-06 |
| 10777444 | Wafer arrangement and method for processing a wafer | Gerald Lackner, Josef Unterweger | 2020-09-15 |
| 10763151 | Wafer carrier, method for manufacturing the same and method for carrying a wafer | Roland Rupp, Ronny Kern, Josef Unterweger | 2020-09-01 |
| 10749216 | Battery, integrated circuit and method of manufacturing a battery | Ravi Keshav Joshi, Alexander Breymesser, Bernhard Goller, Kamil Karlovsky, Peter Zorn | 2020-08-18 |
| 10699934 | Substrate carrier, a processing arrangement and a method | Roland Rupp, Ronny Kern, Josef Unterweger | 2020-06-30 |
| 10665687 | Method for processing a semiconductor device and semiconductor device | Hans-Joachim Schulze, Andreas Haertl, Andre Rainer Stegner, Daniel Schloegl | 2020-05-26 |
| 10643897 | Method of forming a semiconductor device | Roland Rupp, Hans-Joachim Schulze | 2020-05-05 |
| 10643860 | Methods of thinning and structuring semiconductor wafers by electrical discharge machining | Nirdesh Ojha | 2020-05-05 |
| 10615272 | Method for producing IGBT with dV/dt controllability | Antonio Vellei, Markus Bina, Matteo Dainese, Christian Jaeger, Johannes Georg Laven +1 more | 2020-04-07 |
| 10615040 | Superjunction structure in a power semiconductor device | Roland Rupp, Alexander Breymesser, Andre Brockmeier, Ronny Kern, Carsten von Koblinski | 2020-04-07 |
| 10611630 | Method for processing a monocrystalline substrate and micromechanical structure | Andre Brockmeier, Roland Rupp | 2020-04-07 |
| 10529612 | Method for processing one semiconductor wafer or a plurality of semiconductor wafers and protective cover for covering the semiconductor wafer | Roland Rupp | 2020-01-07 |