Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10752744 | Thermally conductive resin, resin composition, prepreg, and copper clad laminate | Feng-Po Tseng, Kuo-Chan Chiou | 2020-08-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10752744 | Thermally conductive resin, resin composition, prepreg, and copper clad laminate | Feng-Po Tseng, Kuo-Chan Chiou | 2020-08-25 |