Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813228 | Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material | Lee C. Kresge, Elaina Zito | 2020-10-20 |
| 10756039 | Fluxes effective in suppressing non-wet-open at BGA assembly | Fengying Zhou, Fen Chen | 2020-08-25 |