Issued Patents 2020
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813228 | Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material | Elaina Zito, Ning-Cheng Lee | 2020-10-20 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10813228 | Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material | Elaina Zito, Ning-Cheng Lee | 2020-10-20 |