Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10763159 | Method for forming a multi-level interconnect structure | Christopher Wilson, Juergen Boemmels | 2020-09-01 |
| 10672655 | Method of patterning target layer | Ivan Zyulkov, Katia Devriendt | 2020-06-02 |