Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10832953 | Technological method for preventing, by means of buried etch stop layers, the creation of vertical/lateral inhomogeneities when etching through-silicon vias | Matthias Wietstruck, Mehmet Kaynak, Philip Kulse, Marco Lisker, Dirk Wolansky | 2020-11-10 |