Issued Patents 2020
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10833038 | Dual bond pad structure for photonics | Jeffrey P. Gambino, Robert K. Leidy, Jeffrey C. Maling | 2020-11-10 |
| 10734346 | Method of manufacturing chip-on-chip structure comprising sinterted pillars | Jay F. Leonard, David J. West, Charles H. Wilson | 2020-08-04 |
| 10651135 | Tamper detection for a chip package | Ezra D. B. Hall, Faraydon Pakbaz, Sebastian T. Ventrone | 2020-05-12 |