Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10768245 | Compliant pin with self sensing deformation | Joseph Kuczynski, Scott B. King, Bruce J. Chamberlin | 2020-09-08 |
| 10739679 | Ruggedized solder mask material | Mark J. Jeanson, Joseph Kuczynski | 2020-08-11 |
| 10679926 | Method of making integrated die paddle structures for bottom terminated components | Stephen M. Hugo, Mark J. Jeanson | 2020-06-09 |
| 10674613 | Via stub elimination by disrupting plating | Joseph Kuczynski, Bruce J. Chamberlin, Scott B. King | 2020-06-02 |
| 10670964 | Ruggedized solder mask material | Mark J. Jeanson, Joseph Kuczynski | 2020-06-02 |
| 10617014 | Via stub elimination by disrupting plating | Joseph Kuczynski, Bruce J. Chamberlin, Scott B. King | 2020-04-07 |
| 10590037 | Liquid immersion techniques for improved resistance to conductive anodic filament formation | Bruce J. Chamberlin, Scott B. King, Joseph Kuczynski | 2020-03-17 |
| 10559522 | Integrated die paddle structures for bottom terminated components | Stephen M. Hugo, Mark J. Jeanson | 2020-02-11 |