Issued Patents 2020
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10834811 | Implementing reworkable strain relief packaging structure for electronic component interconnects | — | 2020-11-10 | $848,000 |
| 10804629 | Beveling staggered card edges | Sandra J. Shirk/Heath, Paul W. Schaefer | 2020-10-13 | $4,674,000 |
| 10779391 | Integrated circuit device assembly | David Barron, Matthew T. Richardson, Christopher W. Mann, Roger Duane Hamilton, Jason R. Eagle | 2020-09-15 | $3,481,000 |
| 10756009 | Efficient placement of grid array components | Brian S. Beaman, Yuet-Ying Yu, Theron Lee Lewis | 2020-08-25 | $2,454,000 |
| 10653037 | Thermal interface material structures | Phillip V. Mann | 2020-05-12 | $2,725,000 |
| 10607859 | Adhesive-bonded thermal interface structures | Karl Stathakis, Phillip V. Mann | 2020-03-31 | $1,667,000 |