Issued Patents 2020
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10881007 | Recondition process for BGA using flux | Tim Bartsch, James D. Bielick, David J. Braun, Timothy P. Younger | 2020-12-29 |
| 10834839 | Barrier for hybrid socket movement reduction | Theron Lee Lewis, Timothy J. Jennings, Timothy P. Younger, David J. Braun, John R. Dangler +2 more | 2020-11-10 |
| 10677856 | Facilitating reliable circuit board press-fit connector assembly fabrication | Stephen M. Hugo, Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler +2 more | 2020-06-09 |
| 10678316 | Reducing thermal cycling fatigue | Eric J. Campbell, Sarah K. Czaplewski-Campbell | 2020-06-09 |
| 10667433 | Implementing contained thermal interface material for pluggable applications | Eric J. Campbell, Sarah K. Czaplewski-Campbell, Elin F. LaBreck | 2020-05-26 |
| 10593601 | Dye and pry process for removing quad flat no-lead packages and bottom termination components | Tim Bartsch, James D. Bielick, David J. Braun, John R. Dangler, Stephen M. Hugo +2 more | 2020-03-17 |
| 10575393 | Heat-shielding microcapsules for protecting temperature sensitive components | Eric J. Campbell, Sarah K. Czaplewski-Campbell, Elin F. LaBreck | 2020-02-25 |
| 10575448 | Electromagnetic shielding of heat sinks with shape-memory alloy grounding | Theron Lee Lewis, Timothy P. Younger, David J. Braun, James D. Bielick, Stephen M. Hugo +1 more | 2020-02-25 |