HL

Hong Lin

CC Chengdu Image Design Technology Co.: 1 patents #3 of 9Top 35%
SC Shanghai Ic R&D Center Co.: 1 patents #3 of 10Top 30%
📍 Shanghai, NY: #37 of 65 inventorsTop 60%
Overall (2020): #446,471 of 565,922Top 80%
1
Patents 2020

Issued Patents 2020

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10796913 Method for hybrid wafer-to-wafer bonding — 2020-10-06