Issued Patents 2020
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10831249 | Heat conduction component and mobile terminal | Huawen Jiang | 2020-11-10 |
| 10756000 | Heat dissipation assembly and electronic device | Yongwang Xiao, Guoping Wang, Jie Zou, Hualin Li | 2020-08-25 |
| 10736237 | Heat sink, preparation method therefor, and communications device | Yan Xu | 2020-08-04 |
| 10729036 | Heat dissipation structure for electronic device and electronic device | Guo Yang, Shuainan Lin | 2020-07-28 |