Issued Patents 2020
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10875074 | Die mechanism, apparatus, and method for shaping a component for creep-age forming | Aaron C. L. Lam, Zhusheng SHI, Yuansong Zeng, Zhiqiang Li, Jianguo Lin | 2020-12-29 |