Issued Patents 2020
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756077 | Chip packaging method | Wen-Yuan Chang, Yeh Hsu, Hsueh-Chung Shelton Lu | 2020-08-25 |
| 10701807 | Multi-layer circuit board structure | Jin-Kae Jang | 2020-06-30 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10756077 | Chip packaging method | Wen-Yuan Chang, Yeh Hsu, Hsueh-Chung Shelton Lu | 2020-08-25 |
| 10701807 | Multi-layer circuit board structure | Jin-Kae Jang | 2020-06-30 |